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"Pre-Bond Probing of Through-Silicon Vias in 3-D Stacked ICs."
Brandon Noia, Krishnendu Chakrabarty (2013)
- Brandon Noia, Krishnendu Chakrabarty:
Pre-Bond Probing of Through-Silicon Vias in 3-D Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(4): 547-558 (2013)
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