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"Pre-Bond Probing of Through-Silicon Vias in 3-D Stacked ICs."

Brandon Noia, Krishnendu Chakrabarty (2013)

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DOI: 10.1109/TCAD.2012.2226455

access: closed

type: Journal Article

metadata version: 2022-01-03

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Brandon Noia, Krishnendu Chakrabarty:
Pre-Bond Probing of Through-Silicon Vias in 3-D Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(4): 547-558 (2013)

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