"TRUST: Through-Silicon via Repair Using Switch Matrix Topology."

Hayoung Lee et al. (2023)

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DOI: 10.1109/TCAD.2022.3220711

access: closed

type: Journal Article

metadata version: 2024-02-27

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Hayoung Lee, Seung Ho Shin, Younwoo Yoo, Sungho Kang:
TRUST: Through-Silicon via Repair Using Switch Matrix Topology. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(7): 2377-2390 (2023)

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