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"The MTA: An Advanced and Versatile Thermal Simulator for Integrated Systems."

Scott Ladenheim et al. (2018)

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DOI: 10.1109/TCAD.2018.2789729

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - journals/tcad/LadenheimCMP18
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  - https://dblp.org/rec/journals/tcad/LadenheimCMP18
Scott Ladenheim, Yi-Chung Chen, Milan Mihajlovic, Vasilis F. Pavlidis:
The MTA: An Advanced and Versatile Thermal Simulator for Integrated Systems. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37(12): 3123-3136 (2018)

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