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"Built-In Self-Repair Scheme for the TSVs in 3-D ICs."

Yu-Jen Huang, Jin-Fu Li (2012)

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DOI: 10.1109/TCAD.2012.2198475

access: closed

type: Journal Article

metadata version: 2023-10-17

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Yu-Jen Huang, Jin-Fu Li:
Built-In Self-Repair Scheme for the TSVs in 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(10): 1600-1613 (2012)

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