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"Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board ..."

Stijn Wielandt et al. (2022)

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DOI: 10.3390/S22072814

access: open

type: Journal Article

metadata version: 2022-05-18

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  - https://dblp.org/rec/journals/sensors/WielandtUFD22
Stijn Wielandt, Sebastian Uhlemann, Sylvain Fiolleau, Baptiste Dafflon:
Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature. Sensors 22(7): 2814 (2022)

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