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"Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer."

Lei Su et al. (2013)

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DOI: 10.3390/S131216281

access: open

type: Journal Article

metadata version: 2020-05-30

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  dblp key:
  - journals/sensors/SuSXLL13
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  - https://dblp.org/rec/journals/sensors/SuSXLL13
Lei Su, Tielin Shi, Zhensong Xu, Xiangning Lu, Guanglan Liao:
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer. Sensors 13(12): 16281-16291 (2013)

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