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"Investigating a Machine Learning Approach to Predicting White Pixel ..."

Dong-Her Shih et al. (2024)

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DOI: 10.3390/S24103144

access: open

type: Journal Article

metadata version: 2024-06-18

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  - journals/sensors/ShihYWS24
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  - https://dblp.org/rec/journals/sensors/ShihYWS24
Dong-Her Shih, Cheng-Yu Yang, Ting-Wei Wu, Ming-Hung Shih:
Investigating a Machine Learning Approach to Predicting White Pixel Defects in Wafers - A Case Study of Wafer Fabrication Plant F. Sensors 24(10): 3144 (2024)

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