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"Comparison of Ultrasonic Welding and Thermal Bonding for the Integration ..."

Marco Matteucci et al. (2016)

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DOI: 10.3390/S16111795

access: open

type: Journal Article

metadata version: 2021-10-14

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  - journals/sensors/MatteucciHZET16
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  - https://dblp.org/rec/journals/sensors/MatteucciHZET16
Marco Matteucci, Arto Heiskanen, Kinga Zór, Jenny Emnéus, Rafael J. Taboryski:
Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry. Sensors 16(11): 1795 (2016)

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