Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Monitoring Strain Response of Epoxy Resin during Curing and Cooling Using ..."

Hongyu Dong et al. (2021)

> Home

Details and statistics

DOI: 10.3390/S21010172

access: open

type: Journal Article

metadata version: 2022-10-02

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/sensors/DongLNWZHWWHL21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/sensors/DongLNWZHWWHL21
Hongyu Dong, Huiming Liu, Arata Nishimura, Zhixiong Wu, Hengcheng Zhang, Yemao Han, Tao Wang, Yongguang Wang, Chuanjun Huang, Laifeng Li:
Monitoring Strain Response of Epoxy Resin during Curing and Cooling Using an Embedded Strain Gauge. Sensors 21(1): 172 (2021)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.