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"Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias ..."

Zuohuan Chen, Daquan Yu, Yi Zhong (2022)

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DOI: 10.3390/S22062114

access: open

type: Journal Article

metadata version: 2022-05-18

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  - journals/sensors/ChenYZ22
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Zuohuan Chen, Daquan Yu, Yi Zhong:
Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter. Sensors 22(6): 2114 (2022)

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