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"An Overview of Non-Destructive Testing Methods for Integrated Circuit ..."

Pouria Aryan, Santhakumar Sampath, Hoon Sohn (2018)

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DOI: 10.3390/S18071981

access: open

type: Journal Article

metadata version: 2023-09-30

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Pouria Aryan, Santhakumar Sampath, Hoon Sohn:
An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection. Sensors 18(7): 1981 (2018)

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