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ORCID"Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering ..."
Jun Eon An et al. (2019)
- Jun Eon An, Usung Park, Dong Geon Jung, Chihyun Park, Seong-Ho Kong:
Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress. Sensors 19(18): 3979 (2019)
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