Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Geometric modelling of IC die bonds for inspection."

King N. Ngan, Sing B. Kang (1989)

> Home

Details and statistics

DOI: 10.1016/0167-8655(89)90017-2

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/prl/NganK89
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/prl/NganK89
King N. Ngan, Sing B. Kang:
Geometric modelling of IC die bonds for inspection. Pattern Recognit. Lett. 10(1): 47-52 (1989)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.