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"Wafer Direct Bonding: From Advanced Substrate Engineering to Future ..."

Silke H. Christiansen, Rajendra Singh, Ulrich Gosele (2006)

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DOI: 10.1109/JPROC.2006.886026

access: closed

type: Journal Article

metadata version: 2020-10-02

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  - https://dblp.org/rec/journals/pieee/ChristiansenSG06
Silke H. Christiansen, Rajendra Singh, Ulrich Gosele:
Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics. Proc. IEEE 94(12): 2060-2106 (2006)

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