"Comments, with reply, on 'Future trends in wafer scale integration' by ..."

Gilman Chesley (1988)

> Home

Details and statistics

DOI: 10.1109/5.4404

access: closed

type: Journal Article

metadata version: 2022-09-09

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/pieee/Chesley88
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/pieee/Chesley88
Gilman Chesley:
Comments, with reply, on 'Future trends in wafer scale integration' by R.O. Carlson and C.A. Neugebauer. Proc. IEEE 76(3): 283-284 (1988)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.