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"A fast algorithm for detecting die extrusion defects in IC packages."

H. Zhou, Ashraf A. Kassim, Surendra Ranganath (1998)

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DOI: 10.1007/S001380050088

access: closed

type: Journal Article

metadata version: 2017-05-17

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  - journals/mva/ZhouKR98
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  - https://dblp.org/rec/journals/mva/ZhouKR98
H. Zhou, Ashraf A. Kassim, Surendra Ranganath:
A fast algorithm for detecting die extrusion defects in IC packages. Mach. Vis. Appl. 11(1): 37-41 (1998)

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