Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"TsanKit: artificial intelligence for solder ball head-in-pillow defect ..."

Ting-Chen Tsan, Teng-Fu Shih, Chiou-Shann Fuh (2021)

> Home

Details and statistics

DOI: 10.1007/S00138-021-01192-8

access: closed

type: Journal Article

metadata version: 2021-04-07

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mva/TsanSF21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mva/TsanSF21
Ting-Chen Tsan, Teng-Fu Shih, Chiou-Shann Fuh:
TsanKit: artificial intelligence for solder ball head-in-pillow defect inspection. Mach. Vis. Appl. 32(3): 66 (2021)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.