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"Effect of solder creep on the reliability of large area die attachment."

W. D. Zhuang et al. (2001)

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DOI: 10.1016/S0026-2714(01)00101-9

access: closed

type: Journal Article

metadata version: 2020-02-22

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W. D. Zhuang, P. C. Chang, F. Y. Chou, R. K. Shiue:
Effect of solder creep on the reliability of large area die attachment. Microelectron. Reliab. 41(12): 2011-2021 (2001)

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