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"Interfacial reaction between the electroless nickel immersion gold ..."

Ruihong Zhang et al. (2009)

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DOI: 10.1016/J.MICROREL.2008.12.016

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/ZhangZGX09
Ruihong Zhang, Ran Zhao, Fu Guo, Zhidong Xia:
Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders. Microelectron. Reliab. 49(3): 303-309 (2009)

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