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"Simulation study on thermo-fatigue failure behavior of solder joints in ..."
Zhi-Hao Zhang et al. (2017)
- Zhi-Hao Zhang, Xi-Shu Wang, Huai-Hui Ren, Su Jia, Hui-Hua Yang:
Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure. Microelectron. Reliab. 75: 127-134 (2017)
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