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"Design considerations for the mechanical integrity of airgaps in ..."

Houman Zahedmanesh et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.01.015

access: closed

type: Journal Article

metadata version: 2022-12-02

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Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei:
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. Microelectron. Reliab. 59: 102-107 (2016)

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