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"Chip warpage model for reliability prediction of delamination failures."

Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee (2012)

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DOI: 10.1016/J.MICROREL.2011.11.013

access: closed

type: Journal Article

metadata version: 2020-02-22

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Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee:
Chip warpage model for reliability prediction of delamination failures. Microelectron. Reliab. 52(4): 718-724 (2012)

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