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"Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system."

Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma (2007)

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DOI: 10.1016/J.MICROREL.2006.09.028

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/YamanakaTS07
Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma:
Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system. Microelectron. Reliab. 47(8): 1280-1287 (2007)

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