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"Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce ..."

H. X. Xie, Nikhilesh Chawla (2013)

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DOI: 10.1016/J.MICROREL.2012.12.010

access: closed

type: Journal Article

metadata version: 2020-09-10

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H. X. Xie, Nikhilesh Chawla:
Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints. Microelectron. Reliab. 53(5): 733-740 (2013)

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