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"Nanomechanical properties of Ag solder bumps doped with Pd and Au."

Hua-Chiang Wen et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.05.037

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/WenCLJ17
Hua-Chiang Wen, Wu-Ching Chou, Shiuan Huei Lin, Don Son Jiang:
Nanomechanical properties of Ag solder bumps doped with Pd and Au. Microelectron. Reliab. 79: 270-275 (2017)

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