"Simulation and measurement of the flip chip solder bumps with a Cu-plated ..."

Kirsten Weide-Zaage et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.02.021

access: closed

type: Journal Article

metadata version: 2020-02-22

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Kirsten Weide-Zaage, J. Schlobohm, R. T. H. Rongen, F. C. Voogt, R. Roucou:
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. Microelectron. Reliab. 54(6-7): 1206-1211 (2014)

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