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"Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free ..."

Yi-Wun Wang, Y. W. Lin, C. Robert Kao (2009)

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DOI: 10.1016/J.MICROREL.2008.09.010

access: closed

type: Journal Article

metadata version: 2022-04-09

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Yi-Wun Wang, Y. W. Lin, C. Robert Kao:
Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates. Microelectron. Reliab. 49(3): 248-252 (2009)

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