"Microstructural and thermal characterizations of light-emitting diode ..."

Tzu-Hao Wang et al. (2016)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2016.06.012

access: closed

type: Journal Article

metadata version: 2024-10-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/WangLCCHCH16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/WangLCCHCH16
Tzu-Hao Wang, Hsuan Lee, Chih-Ming Chen, Ming-Guan Chen, Chi-Chang Hu, Yu-Jie Chen, Ray-Hua Horng:
Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material. Microelectron. Reliab. 63: 68-75 (2016)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.