"Reduction of annealed-induced wafer defects in dual-damascene copper ..."

Yasmin Abdul Wahab et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.07.008

access: closed

type: Journal Article

metadata version: 2022-02-04

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Yasmin Abdul Wahab, Anuar Fadzil Ahmad, Hanim Hussin, Norhayati Soin:
Reduction of annealed-induced wafer defects in dual-damascene copper interconnects. Microelectron. Reliab. 52(9-10): 1975-1980 (2012)

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