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"New assembling technique for BGA packages without thermal processes."

Valentin Videkov et al. (2001)

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DOI: 10.1016/S0026-2714(00)00257-2

access: closed

type: Journal Article

metadata version: 2020-02-22

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Valentin Videkov, Slavka Tzanova, Radosvet Arnaudov, Nikolai Iordanov:
New assembling technique for BGA packages without thermal processes. Microelectron. Reliab. 41(4): 611-615 (2001)

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