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"Electromigration behavior of dual-damascene Cu interconnects--Structure, ..."

A. V. Vairagar, S. G. Mhaisalkar, Ahila Krishnamoorthy (2004)

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DOI: 10.1016/J.MICROREL.2003.12.011

access: closed

type: Journal Article

metadata version: 2020-02-22

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A. V. Vairagar, S. G. Mhaisalkar, Ahila Krishnamoorthy:
Electromigration behavior of dual-damascene Cu interconnects--Structure, width, and length dependences. Microelectron. Reliab. 44(5): 747-754 (2004)

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