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"Pull-off test in the assessment of adhesion at printed wiring board ..."

Markus P. K. Turunen et al. (2004)

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DOI: 10.1016/J.MICROREL.2004.01.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Markus P. K. Turunen, Pekka Marjamäki, Matti Paajanen, Jouko Lahtinen, Jorma K. Kivilahti:
Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface. Microelectron. Reliab. 44(6): 993-1007 (2004)

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