"An investigation into warpages, stresses and keep-out zone in 3D ..."

Ming-Yi Tsai et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.08.017

access: closed

type: Journal Article

metadata version: 2024-05-02

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Ming-Yi Tsai, P. S. Huang, C. Y. Huang, P. C. Lin, Lawrence Huang, Michael Chang, Steven Shih, J. P. Lin:
An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages. Microelectron. Reliab. 54(12): 2898-2904 (2014)

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