"Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: ..."

Markus Thoben et al. (2001)

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DOI: 10.1016/S0026-2714(01)00210-4

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type: Journal Article

metadata version: 2024-08-19

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Markus Thoben, X. Xie, D. Silber, Jürgen Wilde:
Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size. Microelectron. Reliab. 41(9-10): 1719-1723 (2001)

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