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"Comprehensive board-level solder joint reliability modeling and testing of ..."

Tong Yan Tee et al. (2003)

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DOI: 10.1016/S0026-2714(03)00184-7

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong:
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages. Microelectron. Reliab. 43(8): 1329-1338 (2003)

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