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"Impact life prediction modeling of TFBGA packages under board level drop test."

Tong Yan Tee et al. (2004)

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DOI: 10.1016/J.MICROREL.2004.03.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/TeeNLPZ04
Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong:
Impact life prediction modeling of TFBGA packages under board level drop test. Microelectron. Reliab. 44(7): 1131-1142 (2004)

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