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"Reliability assessment and hygroswelling modeling of FCBGA with no-flow ..."

Tong Yan Tee et al. (2003)

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DOI: 10.1016/S0026-2714(03)00035-0

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/TeeKYTBZ03
Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong:
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. Microelectron. Reliab. 43(5): 741-749 (2003)

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