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"Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP."

Y. A. Su et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.01.043

access: closed

type: Journal Article

metadata version: 2020-10-26

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Y. A. Su, Long Bin Tan, T. Y. Tee, Vincent B. C. Tan:
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. Microelectron. Reliab. 50(4): 564-576 (2010)

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