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"Mechanical loading of flip chip joints before underfill: the impact on ..."

Frank Stepniak (2004)

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DOI: 10.1016/J.MICROREL.2003.08.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Frank Stepniak:
Mechanical loading of flip chip joints before underfill: the impact on yield and reliability. Microelectron. Reliab. 44(5): 805-814 (2004)

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