"Board level investigation of BGA solder joint deformation strength."

Bálint Sinkovics, Olivér Krammer (2009)

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DOI: 10.1016/J.MICROREL.2009.02.021

access: closed

type: Journal Article

metadata version: 2020-02-22

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Bálint Sinkovics, Olivér Krammer:
Board level investigation of BGA solder joint deformation strength. Microelectron. Reliab. 49(6): 573-578 (2009)

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