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"The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu ..."
Sun-Kyoung Seo et al. (2009)
- Sun-Kyoung Seo, Sung K. Kang, Da-Yuan Shih, Hyuck Mo Lee:
The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging. Microelectron. Reliab. 49(3): 288-295 (2009)
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