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"In-situ X-ray μLaue diffraction study of copper through-silicon vias."

Dario Ferreira Sanchez et al. (2016)

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DOI: 10.1016/J.MICROREL.2015.10.008

access: closed

type: Journal Article

metadata version: 2021-10-14

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  dblp key:
  - journals/mr/SanchezRWMRMGB16
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  - https://dblp.org/rec/journals/mr/SanchezRWMRMGB16
Dario Ferreira Sanchez, Shay Reboh, Monica Larissa Djomeni Weleguela, Jean-Sébastien Micha, Odile Robach, Thierry Mourier, Patrice Gergaud, Pierre Bleuet:
In-situ X-ray μLaue diffraction study of copper through-silicon vias. Microelectron. Reliab. 56: 78-84 (2016)

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