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"Repairing bonding wire connections using a microsoldering unit inside an SEM."
Andreas Rummel et al. (2013)
- Andreas Rummel, Klaus Schock, Matthias Kemmler, Andrew Smith, Stephan Kleindiek:
Repairing bonding wire connections using a microsoldering unit inside an SEM. Microelectron. Reliab. 53(9-11): 1427-1429 (2013)
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