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"Role of impact ultrasound on bond strength and Al pad splash in Cu wire ..."

Alireza Rezvani et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.03.003

access: closed

type: Journal Article

metadata version: 2023-11-13

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Alireza Rezvani, Aashish Shah, M. Mayer, Norman Y. Zhou, J. T. Moon:
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. Microelectron. Reliab. 53(7): 1002-1008 (2013)

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