Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Fracture analysis on die attach adhesives for stacked packages based on ..."

Huai-Hui Ren, Xi-Shu Wang, Su Jia (2013)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2013.04.001

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/RenWJ13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/RenWJ13
Huai-Hui Ren, Xi-Shu Wang, Su Jia:
Fracture analysis on die attach adhesives for stacked packages based on in-situ testing and cohesive zone model. Microelectron. Reliab. 53(7): 1021-1028 (2013)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.