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"Investigation of delaminations during thermal stress: scanning acoustic ..."

P. Rajamand et al. (2003)

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DOI: 10.1016/S0026-2714(03)00309-3

access: closed

type: Journal Article

metadata version: 2021-06-01

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P. Rajamand, Rainer Tilgner, Roland Schmidt, J. Baumann, P. Klofac, M. Rothenfusser:
Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures. Microelectron. Reliab. 43(9-11): 1815-1820 (2003)

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