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"Degradation of moulding compounds during highly accelerated stress tests - ..."

Reinhard Pufall et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.03.016

access: closed

type: Journal Article

metadata version: 2021-07-26

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Reinhard Pufall, Michael Goroll, Joachim Mahler, Werner Kanert, M. Bouazza, Olaf Wittler, Rainer Dudek:
Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests. Microelectron. Reliab. 52(7): 1266-1271 (2012)

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