"Long time reliability study of soldered flip chips on flexible substrates."

Barbara Pahl et al. (2004)

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DOI: 10.1016/J.MICROREL.2003.10.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl:
Long time reliability study of soldered flip chips on flexible substrates. Microelectron. Reliab. 44(2): 309-314 (2004)

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