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"Robust Electromigration reliability through engineering optimization."

Wee Loon Ng et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.096

access: closed

type: Journal Article

metadata version: 2022-10-02

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  - https://dblp.org/rec/journals/mr/NgTLEATP14
Wee Loon Ng, Kheng Chok Tee, Junfeng Liu, Yong Chiang Ee, Oliver Aubel, Chuan Seng Tan, Kin Leong Pey:
Robust Electromigration reliability through engineering optimization. Microelectron. Reliab. 54(9-10): 1666-1670 (2014)

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