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"An investigation into the reliability of power modules considering ..."

Alexandre Micol et al. (2009)

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DOI: 10.1016/J.MICROREL.2009.06.046

access: closed

type: Journal Article

metadata version: 2021-03-25

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Alexandre Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, Eric Woirgard, Olivier Dalverny, Moussa Karama:
An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. Microelectron. Reliab. 49(9-11): 1370-1374 (2009)

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